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    P1202-2 set ESD Magnetic Field Coupling

      Description

      The field source, which are included in the probe set ESD/magnetic field coupling, generates magnetic ESD fields. With this field, ICs are defined and reproducibly pulsed to determine their immunity against ESD fields.

      The reason for this is the ESD immunity of PC boards and electrical devices. The immunity is tested (IEC 61000-4-2). During the tests electric and magnetic fields are generated by coupled ESD interference into the PC boards. These fields affect the PC board surface and penetrate the IC casings. If fields penetrate the ICs, disturbance events will be generated. The IC interference via magnetic or electrical fields is a significant source of interference / interference path in addition to the conducted coupling of ESD interference above the ICs.
      The knowledge gained about IC EMC behaviour is streamlined into the development of an assembly. Hence, expensive redesigns are avoided and development costs are reduced.
      Furthermore, the use of the test methods for the determination of IC EMC parameters enables the IC producer to develop ICs more efficiently.

      The test set up needs the ICE1 test system and external devices.

      P1202-2 set ESD Magnetic Field Coupling

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          Description

          The field source, which are included in the probe set ESD/magnetic field coupling, generates magnetic ESD fields. With this field, ICs are defined and reproducibly pulsed to determine their immunity against ESD fields.

          The reason for this is the ESD immunity of PC boards and electrical devices. The immunity is tested (IEC 61000-4-2). During the tests electric and magnetic fields are generated by coupled ESD interference into the PC boards. These fields affect the PC board surface and penetrate the IC casings. If fields penetrate the ICs, disturbance events will be generated. The IC interference via magnetic or electrical fields is a significant source of interference / interference path in addition to the conducted coupling of ESD interference above the ICs.
          The knowledge gained about IC EMC behaviour is streamlined into the development of an assembly. Hence, expensive redesigns are avoided and development costs are reduced.
          Furthermore, the use of the test methods for the determination of IC EMC parameters enables the IC producer to develop ICs more efficiently.

          The test set up needs the ICE1 test system and external devices.

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